CLEVER

Features of RPS(Remote Plasma Source)

• Easy Maintenance, minimizes chamber inner wall damages by forming plasma in separate spaces

• Use of high purity quartz materials to minimize radical loss

• Minimize reflection through frequency matching (Integration of RF generator with Matching box)

• Minimize physical damage to samples while maximizing photo resistance ashing rate

Differentiation of CLEVER’s Asher

Key Point	Contents
High Efficiency	• Selection of Plasma Source with High O₂ Throughput • Minimize Radical Loss
High Uniformity	• Development of Viscos Flow Measurement
Low Cost	• Localization of High Performance Remote Pl11asma Source
Minimization	• Development of Narrow Equipment by Applying Multi Chambers

Item	Existing Equipment	Other Companies	Clever
RPS O₂ Throughput	MAX 4SLM	Limit of Process Window	> x2	ICP High Power/ Low Voltage Control Technology
Plasma Ignition	Min 1KW	Minimize Process Window	Min 180W	ICP High Power/ Low Voltage Control Technology
Viscos Flow Measurement	Exhaust Balance X	Uniformity ↓ Over Ashing Time ↑	Exhaust Balance O	Uniformity ↑ Reduction of Over Ashing Time
Viscos Flow Measurement	Inhalation Balance X	Uniformity ↓ Over Ashing Time ↑	Inhalation Balance O	Uniformity ↑ Reduction of Over Ashing Time